US Patent Issued to DENSO on Dec. 23 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,045, issued on Dec. 23, was assigned to DENSO Corp. (Kariya, Japan).

"Semiconductor device" was invented by Tetsuto Yamagishi (Kariya, Japan), Yoshitsugu Sakamoto (Kariya, Japan), Ryoichi Kaizu (Kariya, Japan), Yuki Inaba (Kariya, Japan) and Hiroki Yoshikawa (Kariya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor chip having first and second main electrodes disposed on opposite surfaces of a silicon carbide substrate, first and second heat dissipation members disposed so as to sandwich the semiconductor chip, and joining members disposed between the first main electrode and the first heat dissipa...