ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,923, issued on Aug. 26, was assigned to DENSO Corp. (Kariya, Japan).
"Semiconductor package, electronic device, and method for manufacturing semiconductor package" was invented by Akihiro Yamaguchi (Kariya, Japan), Norihisa Imaizumi (Kariya, Japan), Ryuma Kamikomaki (Kariya, Japan), Kouji Kondoh (Kariya, Japan), Hirotaka Miyano (Kariya, Japan), Tomohiro Yokochi (Kariya, Japan) and Gentarou Masuda (Kariya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member ...