ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,767, issued on April 29, was assigned to DENSO Corp. (Kariya, Japan).
"Semiconductor device" was invented by Hideki Kawahara (Kariya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor element, a conductive member, and solder portions. The semiconductor element includes first main electrodes and a protective film on a first main surface, and a second main electrode on a second main surface. The protective film has an interposed film portion between the first main electrodes. The conductive member has facing portions each facing a corresponding one of the first main electrodes and an interposed conduct...