US Patent Issued to DENSO CORPROATION, TOYOTA JIDOSHA, MIRISE Technologies on Jan. 27 for "Semiconductor device and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,792, issued on Jan. 27, was assigned to DENSO CORPROATION (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor device and method for manufacturing semiconductor device" was invented by Masato Noborio (Nisshin, Japan), Yoshitaka Kato (Nisshin, Japan) and Takeshi Endo (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: an active region having a semiconductor element and a surface electrode provided by a wiring electrode material and connected to the semiconductor element on a side adjacent to a surface of a semiconductor chip; and a pad arrangeme...