US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on Oct. 7 for "Semiconductor module and method for manufacturing semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,071, issued on Oct. 7, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor module and method for manufacturing semiconductor module" was invented by Kazuki Kuwata (Nisshin, Japan), Hiroshi Ishino (Nisshin, Japan), Hirokazu Sampei (Nisshin, Japan) and Masaru Narikawa (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a semiconductor module, first and second connection terminals and a control terminal are electrically connected to a semiconductor chip. The second connection terminal extends in a first direction in a resin molded part and projects ...