US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on Nov. 25 for "Semiconductor device having electric component built in circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,720, issued on Nov. 25, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor device having electric component built in circuit board" was invented by Shohei Nagai (Nisshin, Japan) and Masaki Aoshima (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate main body having a first surface and a second surface, an electric component arranged in the substrate main body, a first internal conductor pattern arranged in a first circuit layer located between the first surface and the electric component, and at least on...