US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on March 25 for "Method for manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,048, issued on March 25, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Method for manufacturing semiconductor device" was invented by Takashi Ishida (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes: irradiating, with laser light, a semiconductor substrate having a p-type first semiconductor layer and an n-type second semiconductor layer so that the laser light converges on an interface between the first semiconductor layer and the second semiconductor layer, wherein each of the p-type first sem...