US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on March 18 for "Semiconductor device and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,120, issued on March 18, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor device and method of manufacturing the same" was invented by Yoshitaka Kato (Nisshin, Japan), Takeshi Endo (Nisshin, Japan) and Kazuhiro Tsuruta (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a power module, a circuit package, and a joint portion joining the power module and the circuit package. The circuit package includes a semiconductor element, a wiring layer electrically connected with the semiconductor element, a heat conductive ...