ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,817, issued on April 29, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).
"Semiconductor device and method for manufacturing the same" was invented by Masato Noborio (Nisshin, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a cell region formed with a semiconductor element and an outer peripheral region surrounding the cell region. The outer peripheral region includes a guard ring part having a plurality of guard rings of the second conductivity-type, and a plurality of guard ring column regions of the second conductivity-type. Each of the ...