US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on April 22 for "Method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,620, issued on April 22, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Method for manufacturing semiconductor device" was invented by Yosuke Maegawa (Nisshin, Japan) and Yohei Iwahashi (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes: preparing a semiconductor substrate; arranging a mask on one surface of the semiconductor substrate; forming opening portions in the mask by patterning so as to expose planned formation regions of the semiconductor substrate where trenches are to be formed; forming ...