US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on April 15 for "Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical component" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,170, issued on April 15, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (Nisshin, Japan).

"Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical component" was invented by Hiroshi Ishino (Nisshin, Japan), Hirokazu Sampei (Nisshin, Japan), Katsuya Kumagai (Nisshin, Japan) and Koji Doi (Nisshin, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a resin molded part encapsulating a semiconductor chip, a first terminal having a plate shape, and a second terminal having a plate shape. The first ter...