ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,704, issued on Sept. 30, was assigned to DENKA COMPANY Ltd. (Tokyo).
"Production method for heat-resistant resin composition" was invented by Kohei Nishino (Tokyo) and Tatsuhiro Matsubara (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a heat resistant resin composition having superior dispersibility of maleimide-based copolymer, the method including: a melt-kneading step to melt and knead a maleimide-based copolymer (A) and at least one resin (B) selected from the group consisting of ABS resin, ASA resin, AES resin, and SAN resin with an extruder; wherein: a ratio of a melt viscosity of the maleimide-based copolyme...