ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,466,956, issued on Nov. 11, was assigned to Denka Co. Ltd. (Tokyo).
"Electroconductive resin composition and molded article of same" was invented by Mutsumi Matsumoto (Tokyo) and Akira Miyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "[Problem] To provide electroconductive resin compositions that accommodate energy devices and have excellent preservability, and molded articles thereof.[Solution] An electroconductive resin composition and a molded article thereof, the composition containing components: (A) a hydrogenated styrene-based thermoplastic elastomer having an MFR (measured at a temperature of 230deg C. and a load of 2.16 kg) of 1 g/10...