US Patent Issued to DENKA on Jan. 28 for "Heat dissipation member and method of manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,213,286, issued on Jan. 28, was assigned to DENKA COMPANY Ltd. (Tokyo).

"Heat dissipation member and method of manufacturing the same" was invented by Daisuke Goto (Omuta, Japan) and Hiroaki Ota (Omuta, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plate-shaped heat dissipation member includes a metal-silicon carbide composite containing aluminum or magnesium, in which at least one of two main surfaces of the heat dissipation member is curved to be convex in an outward direction of the heat dissipation member, and when a flatness of the one main surface defined by JIS B 0621 is represented by f1 and a flatness of the other main surface differen...