ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,917, issued on Jan. 13, was assigned to DENKA COMPANY Ltd. (Tokyo).
"Circuit board and method of production therefor" was invented by Kenji Miyata (Machida, Japan), Shohji Iwakiri (Chikushino, Japan) and Saori Inoue (Kobe, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board having electrodes has good thermal conductivity and excellent voltage resistance and a method of producing the same. The circuit board includes a first ceramic layer, a second ceramic layer laminated thereon, and a first metal layer between the ceramic layers. The circuit board has a metal layer existing zone between the ceramic layers, and a metal layer non-exis...