ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,063, issued on Oct. 21, was assigned to Delta Electronics Inc. (Taoyuan, Taiwan).
"Power-module-heat-dissipation assembly" was invented by Kang-Yu Fan (Taoyuan, Taiwan), Jhih-Yang Li (Taoyuan, Taiwan) and Hsing-Yu Wu (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power-module-heat-dissipation assembly is disclosed and includes plural first power modules, plural second power modules, a cooling-flow-channel inlet, a cooling-flow-channel outlet, a first housing base and a second housing base. The first housing base including a first flow channel and a first heat dissipation surface, and the second housing base including a second flow...