ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,097, issued on June 3, was assigned to DELTA ELECTRONICS INC. (Taoyuan, Taiwan).
"PCB pad for SMT process" was invented by Heng-Chao Chen (Taoyuan, Taiwan) and Chia-Min Ho (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A PCB pad for a SMT process is combined on a PCB. The PCB pad includes an insulation body and a metal reflow portion disposed on the insulation body. The metal reflow portion is located on the side of the insulation body adjacent to the PCB. The metal reflow portion is not electrically connected with the PCB. Thus, the PCB pad may support electronic components of the PCB and prevent the electronic components from being...