ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,016, issued on Sept. 16, was assigned to Delta Electronics (Shanghai) Co. LTD. (Shanghai).
"High-density power supply" was invented by Kunpeng Wang (Shanghai), Mingjuan Zhang (Shanghai), Shuailin Du (Shanghai) and Kai Dong (Shanghai).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-density power supply includes a shell, a fan, a PFC module, a DC-DC module and a main board. The shell has a first air passage and a second air passage arranged side by side. The fan is arranged on an inner side or an outer side of the shell. The PFC module includes a PFC inductor arranged in the first air passage, and the PFC inductor faces directly to the fan. The ...