US Patent Issued to Dell Products on Nov. 11 for "Systems and methods for testing cabled interconnects under mechanical stress" (Texas Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,984, issued on Nov. 11, was assigned to Dell Products LP (Round Rock, Texas).

"Systems and methods for testing cabled interconnects under mechanical stress" was invented by Chandra V. Krishnaswamy (Cedar Park, Texas), Bhyrav Mutnury (Austin, Texas), William Andrew Smith (Round Rock, Texas) and Roshan Pai (Cedar Park, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method may include transmitting first test signals to electrical pathways of a connector-cable interface between a cable and a test circuit board in the absence of and in the presence of mechanical stress applied by a mechanical stressor to the connector-cable interface, performing ...