US Patent Issued to Dell Products on Nov. 11 for "Systems and methods for testing cabled interconnects under mechanical stress" (Texas Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,985, issued on Nov. 11, was assigned to Dell Products LP (Round Rock, Texas).

"Systems and methods for testing cabled interconnects under mechanical stress" was invented by Roshan Pai (Cedar Park, Texas), Chandra V. Krishnaswamy (Cedar Park, Texas), William Andrew Smith (Round Rock, Texas) and Bhyrav Mutnury (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method may include transmitting one or more first test signals to electrical pathways of a connector-cable interface between a cable and a test circuit board in the absence of mechanical stress applied by a mechanical stressor to the connector-cable interface, performing measurement...