ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,213,252, issued on Jan. 28, was assigned to Dell Products LP (Round Rock, Texas).
"CPU for heatsink based power delivery" was invented by Sandor Farkas (Round Rock, Texas), Mark Smith (Georgetown, Texas) and Bhyrav Mutnury (Austin, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A CPU includes a processor die and a substrate. The processor die includes first signal contacts, power contacts, and ground contacts. The processor die is affixed and electrically coupled to the substrate on a first surface of the substrate. The substrate routes the first signal contacts to associated second signal contacts on a second surface of the substrate. The substra...