ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,854, issued on Dec. 30, was assigned to Dell Products LP (Round Rock, Texas).
"Thermal pad service kit" was invented by Shih-Hsuan Hu (New Taipei, Taiwan) and Chi-Chang Fu (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal pad service kit includes a package having a first clamshell and a second clamshell. A thermal pad is enclosed between the first clamshell and the second clamshell, and a first side of the thermal pad is removably coupled to the first clamshell via an adhesive film. A second side of the thermal pad is tacky and removably coupled to a non-adhesive film. The second side of the thermal pad is coupled to a surface...