US Patent Issued to Dell Products on Dec. 16 for "Fiber weave in a printed circuit board substrate" (Indian, American Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,546, issued on Dec. 16, was assigned to Dell Products LP (Round Rock, Texas).

"Fiber weave in a printed circuit board substrate" was invented by Sanjay Kumar (Bangalore, India), Sathvika Bandi (Kothagudem, India), Sukumar Muthusamy (Erode, India), Naga Hara Sathya Sree Tammisetti (Hyderabad, India), Arun Vignesh Palanichamy (Palani, India) and Bhyrav Mutnury (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board substrate including multiple sets of glass rows. The multiple sets of glass rows include a first set of glass rows, a second set of glass rows, and a third set of glass rows. The first set of glass rows extend ...