ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,489, issued on March 25, was assigned to Deere & Co. (Moline, Ill.).
"Packaging of wide bandgap power electronic power stages" was invented by Brij N. Singh (West Fargo, N.D.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Design and packaging of wide bandgap (WBG) power electronic power stages are disclosed herein. An example apparatus includes a first printed circuit board (PCB) including: a first voltage phase circuit cluster; a second voltage phase circuit cluster; and a cluster of traces, the cluster of traces routed substantially perpendicular to the second voltage phase circuit cluster; a second PCB positioned below the first PCB; and a conne...