US Patent Issued to DEEIA on Oct. 21 for "Metallic thermal interface materials and associated devices, systems, and methods" (California Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,042, issued on Oct. 21, was assigned to DEEIA INC. (Saratoga, Calif.).

"Metallic thermal interface materials and associated devices, systems, and methods" was invented by Himanshu Pokharna (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat-transfer component defines a thermal-interface surface and has a composite thermal-interface material bonded to the thermal-interface surface. The composite thermal-interface material comprises a particulate filler material dispersed within a metallic carrier material. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-...