US Patent Issued to Deca Technologies USA on Sept. 23 for "Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same" (Arizona, California, Colorado Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,450, issued on Sept. 23, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same" was invented by Craig Bishop (Scottsdale, Ariz.), Andrew Hoetker (Castle Rock, Colo.), Ryan Sanden (Gilbert, Ariz.), Paul R. Hoffman (San Diego) and Timothy L. Olson (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a substrate comprising an embedded component and further comprising a region of displacement compensation traces (DCTs) may comprise the following. A component comprising conductive contacts. Measuring a s...