US Patent Issued to Deca Technologies USA on Nov. 11 for "Semiconductor assembly comprising a 3D block and method of making the same" (Arizona, Washington, California Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,776, issued on Nov. 11, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Semiconductor assembly comprising a 3D block and method of making the same" was invented by Timothy L. Olson (Phoenix), Craig Bishop (Scottsdale, Ariz.), Robin Davis (Vancouver, Wash.) and Paul R. Hoffman (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making an assembly or package comprising 3D blocks may include forming a conductive element horizontally oriented over a first carrier, forming support material around the conductive element, and singulating the conductive element and the support material to form a plurality of 3D blocks. The meth...