US Patent Issued to Deca Technologies USA on March 25 for "Stackable fully molded semiconductor structure with vertical interconnects" (Arizona Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,140, issued on March 25, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Stackable fully molded semiconductor structure with vertical interconnects" was invented by Timothy L. Olson (Phoenix), Edward Hudson (San Tan Valley, Ariz.) and Craig Bishop (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a semiconductor device may include providing a carrier and forming a first photoresist over the carrier with first openings through the first photoresist. A non-planar conductive seed layer may be formed over the first photoresist and conformally extend into the first openings through the first photoresist. A ...