US Patent Issued to Deca Technologies USA on June 17 for "Unit specific variable or adaptive metal fill and system and method for the same" (Arizona Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,396, issued on June 17, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Unit specific variable or adaptive metal fill and system and method for the same" was invented by David Ryan Bartling (Mesa, Ariz.), Craig Bishop (Scottsdale, Ariz.) and Timothy L. Olson (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device can comprise providing a first shift region in which to determine a first displacement. A second shift region may be provided in which to determine a second displacement. A unique electrically conductive structure may be formed comprising traces to account for the first displacement and...