US Patent Issued to Deca Technologies USA on July 15 for "Method of making a fan-out semiconductor assembly with an intermediate carrier" (Arizona, California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,322, issued on July 15, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Method of making a fan-out semiconductor assembly with an intermediate carrier" was invented by Timothy L. Olson (Phoenix) and Paul R. Hoffman (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a semiconductor assembly may include providing a plurality of components, providing a one or more intermediate carriers, and mounting the plurality of components to the one or more intermediate carriers. The method may further include providing a temporary carrier, mounting the one or more intermediate carriers to the temporary carrier, and disposing ...