US Patent Issued to Deca Technologies USA on Dec. 16 for "Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same" (California, Washington, Minnesota, Arizona Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,198, issued on Dec. 16, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same" was invented by Robin Davis (Vancouver, Wash.), Paul R. Hoffman (San Diego), Clifford Sandstrom (Richfield, Minn.) and Timothy L. Olson (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making a QFN, DEN, or SON package may comprise forming an embedded chip panel comprising a plurality of semiconductor chips embedded in encapsulant and separated by saw streets. A conductive layer may be formed over the embedded chip panel,...