US Patent Issued to Deca Technologies USA on Aug. 5 for "Fully molded bridge interposer and method of making the same" (Arizona, Minnesota Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,154, issued on Aug. 5, was assigned to Deca Technologies USA Inc. (Tempe, Ariz.).

"Fully molded bridge interposer and method of making the same" was invented by Timothy L. Olson (Phoenix), Craig Bishop (Scottsdale, Ariz.) and Clifford Sandstrom (Richfield, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may comprise a bridge die comprising copper studs. Copper posts may be disposed in a periphery of the bridge die. An encapsulant may be disposed on five sides of the bridge die, on sides of the copper studs, and on sides of the copper posts that leave ends of the copper studs and opposing first and second ends of the copper...