US Patent Issued to DDP SPECIALTY ELECTRONIC MATERIALS US 9 on Dec. 9 for "Conductive composite film" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,492,314, issued on Dec. 9, was assigned to DDP SPECIALTY ELECTRONIC MATERIALS US 9 LLC (Midland, Mich.).

"Conductive composite film" was invented by Chen-Yang Shiang (Taoyuan, Taiwan) and I-Hua Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive composite film has four layers: (A) a substrate, (B) a silicone based reactive layer, (C) at least one conductive layer and (D) a silicone encapsulant layer, and the silicone based reactive layer is formed from curable organosiloxane composition."

The patent was filed on April 22, 2022, under Application No. 18/556,029.

*For further information, including images, charts and tables,...