ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,670, issued on Oct. 14, was assigned to DANFOSS SILICON POWER GMBH (Flensburg, Germany).
"Power module" was invented by Ole Muhlfeld (Nordborg, Denmark), Klaus Olesen (Nordborg, Denmark), Matthias Beck (Nordborg, Denmark), Holger Ulrich (Nordborg, Denmark) and Martin Becker (Nordborg, Denmark).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insula...