ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,514, issued on Oct. 21, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).
"Resin composition and molded article" was invented by Koji Nakanishi (Osaka, Japan), Toyomitsu Seki (Osaka, Japan) and Hideki Kono (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition containing an aromatic polyether ketone resin (I); and a fluorine-containing copolymer (II), the resin composition satisfying an r2/r1 ratio of 1.60 or lower, wherein r1 is an average dispersed particle size of the fluorine-containing copolymer (II) and r2 is an average dispersed particle size of the fluorine-containing copolymer (II) after melt flow rate measure...