ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,870, issued on Nov. 4, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).
"Heat exchanger and heat pump apparatus" was invented by Kouju Yamada (Osaka, Japan) and Tomoki Hirokawa (Osaka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat exchanger, that connects to a first pipe through which a refrigerant flows, includes: heat transfer tubes extending in a first direction; and a header connected to the heat transfer tubes. The header includes: a first member including a first portion connected to the heat transfer tubes; and a second member disposed between the first pipe and the first portion. The second member includes: a first wall an...