US Patent Issued to DAIKIN INDUSTRIES on June 24 for "Heat pump device" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,046, issued on June 24, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).

"Heat pump device" was invented by Yukio Matsusaka (Osaka, Japan), Teruo Nishida (Osaka, Japan) and Kento Okuzawa (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump device comprises a refrigerant circuit in which a compressor, a first indoor heat exchanger, an electric expansion valve, and a heat source-side heat exchanger are connected in a loop, a second indoor heat exchanger arranged between the compressor and the electric expansion valve and configured to store refrigerant during positive cycle defrost operation, an electromagnetic valve arranged...