US Patent Issued to DAIKIN INDUSTRIES on Dec. 16 for "Copolymer, molded body, injection molded body, and coated electrical wire" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,473, issued on Dec. 16, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan).

"Copolymer, molded body, injection molded body, and coated electrical wire" was invented by Tadaharu Isaka (Osaka, Japan), Yumi Zenke (Osaka, Japan), Yukari Yamamoto (Osaka, Japan) and Hayato Tsuda (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copolymer containing tetrafluoroethylene unit and perfluoro (propyl vinyl ether) unit, wherein the copolymer has a content of perfluoro (propyl vinyl ether) unit of 3.5 to 4.2% by mass with respect to the whole of the monomer units, a melt flow rate at 372deg C. of 18.0 to 22.0 g/10 min, and the number of functional...