ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,852, issued on Nov. 4, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan) and DAIKIN EUROPE N.V. (Ostend, Belgium).
"Heat pump" was invented by Hideo Chikami (Ostend, Belgium), Akshay Hattiangadi (Ostend, Belgium) and Jasper Van De Vyver (Ostend, Belgium).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump includes a compressor, a first heat exchanger, a main expansion mechanism and a second heat exchanger arranged in a refrigeration path, the compressor having a suction port, a compression port and an injection port; a gas injection valve connected on a first side to the refrigeration path between the first heat exchanger and the main expan...