ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,670, issued on Nov. 11, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan) and DAIKIN EUROPE N.V. (Ostend, Belgium).
"Heat pump device" was invented by Yuusuke Fujimoto (Osaka, Japan), Ryuuichi Toyota (Osaka, Japan), Kentaroh Taoka (Osaka, Japan), Atsushi Ohtani (Osaka, Japan), Kevin Cornelis (Ostend, Belgium) and David Steen (Ostend, Belgium).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump device having a refrigerant circuit includes: a valve configured to maintain an opening degree during non-energization; a valve drive circuit configured to cause operation of the valve; a valve controller configured to control the valve drive circuit...