ALEXANDRIA, Va., Oct. 21 -- United States Patent no. D1,098,056, issued on Oct. 14, was assigned to DAIKIN FINTECH LTD. (Nara, Japan).
"Substrate processing apparatus" was invented by Yasunori Deguchi (Yamatokoriyama, Japan).
The patent was filed on Sept. 12, 2022, under Application No. D/866,426.
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