ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,043, issued on April 8, was assigned to Daicel Corp. (Osaka, Japan).
"Resin molded body, and method for manufacturing same" was invented by Motoharu Haga (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin molded body includes: resin; and a conductive member having a coil shape with a center axis; with a flat surface in at least part of the resin molded body, in which an average angle between the flat surface and the center axis is 50deg or greater."
The patent was filed on July 8, 2021, under Application No. 18/015,111.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser...