US Patent Issued to Dai Nippon Printing on Sept. 23 for "Wiring board and method for manufacturing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,752, issued on Sept. 23, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Wiring board and method for manufacturing wiring board" was invented by Seiji Take (Tokyo), Shuji Kawaguchi (Tokyo) and Chiaki Hatsuta (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the meta...