US Patent Issued to Dai Nippon Printing on March 4 for "Lead frame and manufacturing method thereof" (Japanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,811, issued on March 4, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Lead frame and manufacturing method thereof" was invented by Masahiro Nagata (Tokyo), Kazuhiro Shinozaki (Tokyo), Masahiro Yamada (Tokyo), Daisuke Okuyama (Tokyo), Chiaki Hatsuta (Tokyo), Kentarou Seki (Tokyo), Hideto Matsui (Tokyo) and Kazunori Douchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough sur...