US Patent Issued to Dai Nippon Printing on Dec. 30 for "Deposition mask package and deposition mask packaging method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,797, issued on Dec. 30, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Deposition mask package and deposition mask packaging method" was invented by Chikao Ikenaga (Tokyo), Takumi Oike (Tokyo), Tsukasa Mukaida (Tokyo) and Takeru Watanabe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface faci...