US Patent Issued to Dai Nippon Printing on Dec. 16 for "Barrier laminate, heat sealing laminate including barrier laminate, and packaging container with heat sealing laminate" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,688, issued on Dec. 16, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo).

"Barrier laminate, heat sealing laminate including barrier laminate, and packaging container with heat sealing laminate" was invented by Tsuyoshi Suzuki (Tokyo), Shohei Okumura (Tokyo), Shunsuke Furuya (Tokyo) and Hideaki Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "[Object] To provide a barrier laminate that includes a multilayer substrate with high interlayer adhesiveness to an evaporated film and that has high gas barrier properties.[Solution] A barrier laminate according to the present invention includes a multilayer substrate and an evaporated film,...