US Patent Issued to Daewon Semiconductor Packaging Industrial on Aug. 12 for "Rigid carrier assemblies with tacky media molded thereon" (South Korean, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,957, issued on Aug. 12, was assigned to Daewon Semiconductor Packaging Industrial Co. (Santa Clara, Calif.).

"Rigid carrier assemblies with tacky media molded thereon" was invented by Sunna Chung (Seoul, South Korea), Matthew Stanton Whitlock (Santa Clara, Calif.), Athens Okoren (Hanam, South Korea) and Brent Dae Hermsmeier (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-mold...