US Patent Issued to D2S on Feb. 10 for "Computing and displaying a predicted overlap shape in an IC design based on predicted manufacturing contours" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,804, issued on Feb. 10, was assigned to D2S INC. (San Jose, Calif.).

"Computing and displaying a predicted overlap shape in an IC design based on predicted manufacturing contours" was invented by Donald Oriordan (Sunnyvale, Calif.), Akira Fujimura (Saratoga, Calif.) and George Janac (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments provide a method for computing and displaying of minimum overlap for semiconductor layer interfaces, such as metal-via and metal-contact. The method leverages a machine-trained network (e.g., a trained neural network) to quickly, but accurately, infer the contours for the manufactured shape...