US Patent Issued to CYTEC INDUSTRIES on July 22 for "Primer composition for adhesive bonding and method of using the same" (Maryland, Delaware Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,819, issued on July 22, was assigned to CYTEC INDUSTRIES INC. (Princeton, N.J.).

"Primer composition for adhesive bonding and method of using the same" was invented by Yiqiang Zhao (Newark, Del.) and Dalip Kohli (Churchville, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a solvent-based bonding primer composition containing one or more organic solvents, one or more epoxy resins, one or more curing agents, a silane compound, and a low amount of core-shell rubber particles in nanometer size, submicron or micron size. Also disclosed is a method of applying the solvent-based bonding primer composition onto a metallic surface of ...