US Patent Issued to Cypress Semiconductor on May 27 for "Compact routing package for high frequency isolation" (California Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,790, issued on May 27, was assigned to Cypress Semiconductor Corp. (San Jose, Calif.).

"Compact routing package for high frequency isolation" was invented by Chenxi Huang (San Jose, Calif.) and Yung Chen (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, methods, and devices for a ball grid array with non-linear conductive routing are described herein. Systems include a printed circuit board, a microprocessor, a ball grid array, and a substrate. The ball grid array includes a first solder ball and a second solder ball. The substrate includes a non-linear conductive routing electrically coupling the first solder ball and the se...